1. 2. 3. material content data sheet sales product name bsc190n15ns3 g issued 7. september 2015 ma# ma001398098 package pg-tdson-8-1 weight* 122.22 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip inorganic material silicon 7440-21-3 4.419 3.62 3.62 36152 36152 leadframe non noble metal iron 7439-89-6 0.038 0.03 309 inorganic material phosphorus 7723-14-0 0.011 0.01 93 non noble metal copper 7440-50-8 37.762 30.88 30.92 308961 309363 wire non noble metal copper 7440-50-8 0.065 0.05 0.05 536 536 encapsulation organic material carbon black 1333-86-4 0.080 0.07 652 plastics epoxy resin - 5.661 4.63 46317 inorganic material silicondioxide 60676-86-0 34.125 27.92 32.62 279204 326173 leadfinish non noble metal tin 7440-31-5 1.470 1.20 1.20 12026 12026 plating noble metal silver 7440-22-4 0.166 0.14 0.14 1354 1354 solder noble metal silver 7440-22-4 0.087 0.07 712 non noble metal tin 7440-31-5 0.070 0.06 570 non noble metal lead 7439-92-1 3.324 2.72 2.85 27199 28481 clip plating noble metal silver 7440-22-4 1.289 1.06 1.06 10550 10550 heatspreader non noble metal iron 7439-89-6 0.011 0.01 93 inorganic material phosphorus 7723-14-0 0.003 0.00 28 non noble metal copper 7440-50-8 11.320 9.26 9.27 92619 92740 heat sink clip non noble metal iron 7439-89-6 0.022 0.02 183 inorganic material phosphorus 7723-14-0 0.007 0.01 55 non noble metal copper 7440-50-8 22.292 18.24 18.27 182387 182625 *deviation < 10% sum in total: 100.00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. this product is in compliance with eu directive 2011/65/eu (rohs) and contains pb according rohs exemption 7a, lead in high melting temperature type solders. company infineon technologies ag address 81726 mnchen internet www.infineon.com
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